The Master of Engineering degree offers an area of study in Microelectronics Packaging at Arizona State University. Microelectronic package design and assembly are critical components of high-quality CPU, networking, and memory products. No longer focusing on a single performance characteristic, packaging engineers today must solve complex, coupled problems that require fundamental understanding of electrical, thermal, mechanical, material science, and manufacturing principles. This area of study will provide fundamental and advanced courses to educate both novice and experienced engineers on these topics.

Accreditation

Arizona State University(ASU) is accredited by the Higher Learning Commission of the North Central Association of Colleges and Schools (NCA).

Cost : $22,220.00

Credits : 30